20:05Machine-translated from Azerbaijani by AIRead in Azerbaijani
Diamond Foundry Unveils Single-Crystal Diamond Wafer to Combat AI Chip Overheating
Diamond Foundry has announced that it has developed the world’s first 200 mm single-crystal wafer made from lab-grown diamond for cooling chips. The product is intended for artificial intelligence (AI) chips, which generate more heat as they become more powerful. The wafer is close in size to the silicon wafers used by chipmakers in older manufacturing processes.
Conventional lab-grown diamonds consist of many tiny crystals. This wafer, however, is made from a single, high-quality crystal. Although producing such a material is difficult, it dissipates heat more effectively. Diamond conducts heat at least 5 times better than copper. At the same time, it does not conduct electricity and could reduce overheating in individual parts of a chip. The sample displayed by the company has not yet been polished and is not ready for use in chip manufacturing. The wafer must undergo additional processing first. Diamond Foundry believes it could also develop a 300 mm D300 SCD wafer before 2030. This size will match the wafers used to manufacture the most advanced chips.
Although Diamond Foundry was founded in 2012, work on growing large single-crystal diamonds has been underway since the early 2000s. CEO Martin Roscheisen said the result was achieved through more than 10 years of testing by hundreds of engineers, scientists and technicians. The project’s leading specialists have spent a combined 25 years working toward this goal. Other companies are also testing lab-grown diamonds for cooling chips. Akash Systems received funding from the US CHIPS program in 2024. The amount was $18.2 million (approximately 30.94 million manat). The company claims that gallium nitride bonded with synthetic diamond will reduce the temperature by 20°C. De Beers Group is developing a copper-clad diamond composite for AI and systems requiring high computing power. Frore Systems is also working on diamond-infused water-cooling plates for Nvidia’s next-generation AI graphics processors.
Conventional lab-grown diamonds consist of many tiny crystals. This wafer, however, is made from a single, high-quality crystal. Although producing such a material is difficult, it dissipates heat more effectively. Diamond conducts heat at least 5 times better than copper. At the same time, it does not conduct electricity and could reduce overheating in individual parts of a chip. The sample displayed by the company has not yet been polished and is not ready for use in chip manufacturing. The wafer must undergo additional processing first. Diamond Foundry believes it could also develop a 300 mm D300 SCD wafer before 2030. This size will match the wafers used to manufacture the most advanced chips. Although Diamond Foundry was founded in 2012, work on growing large single-crystal diamonds has been underway since the early 2000s. CEO Martin Roscheisen said the result was achieved through more than 10 years of testing by hundreds of engineers, scientists and technicians. The project’s leading specialists have spent a combined 25 years working toward this goal. Other companies are also testing lab-grown diamonds for cooling chips. Akash Systems received funding from the US CHIPS program in 2024. The amount was $18.2 million (approximately 30.94 million manat). The company claims that gallium nitride bonded with synthetic diamond will reduce the temperature by 20°C. De Beers Group is developing a copper-clad diamond composite for AI and systems requiring high computing power. Frore Systems is also working on diamond-infused water-cooling plates for Nvidia’s next-generation AI graphics processors.