08:36Machine-translated from Azerbaijani by AIRead in Azerbaijani
Intel Secures New Patent for Embedding MicroLEDs in Processors
Intel has secured a new patent that enables MicroLED technology to be used inside processor packages. According to HotHardware, the patent, titled “IC Package With Micro LEDs” and filed in 2022, calls for placing one or more MicroLED components inside glass-based semiconductor packages.
The patent uses “Through-Glass Via” (TGV) connections running through the glass to power the MicroLEDs. The glass structure can also serve as an optical window that allows the light generated by the LEDs to escape.
Intel notes that the technology could be used to create diagnostic indicators and visual elements in processor packages. The patent even gives examples such as creating illuminated lettering on the processor and using microscopic mirrors embedded in the glass to direct LED light in different directions.
However, one of the more notable aspects of the patent is the use of glass-based processor packages rather than the MicroLEDs themselves. Glass could provide greater dimensional stability and surface smoothness than the organic packaging materials currently in use. As processor packages grow in size and connection density, warping and thermal expansion issues that can arise in organic materials become increasingly significant.
Intel previously said that glass-core packages could increase connection density by up to 10 times. According to the company, this technology could also enable the development of larger chip packages and improve signal integrity.
Although integrating MicroLEDs into processor packages appears at first glance to serve primarily a visual function, the patent also raises the possibility of other applications in the future. One of these is the use of optical connections to transfer data between chips.
The semiconductor industry is currently working on using optical technologies to transfer data between processors and other chips. Such connections could reduce interference in electrical signals while also providing advantages in terms of energy consumption and heat. Alongside glass-based packages, Intel is also researching co-packaged optical technologies.
Nevertheless, the patent does not directly indicate that MicroLEDs will be used for optical data transmission. The document primarily describes a method for physically integrating MicroLED components into glass-based processor packages. Combining this approach with optical communication technologies in the future could enable the development of new processor package designs that do not rely solely on electrical connections.