22:49Machine-translated from Azerbaijani by AIRead in Azerbaijani
TSMC Outsources Silicon Interposer Production for AI Chips to GlobalFoundries
“GlobalFoundries” and “TSMC” have signed a 5-year manufacturing agreement worth $2 billion (approximately 3.4 billion manat). Under the agreement, “GlobalFoundries” will produce silicon interposers for “TSMC”’s “CoWoS” packaging technology. Mass production in the US is expected to be ramped up in the first half of 2028. This will allow customers to describe their products as entirely manufactured and packaged in the US.
For this purpose, “GlobalFoundries” will increase the production capacity of its plant in Malta, New York. The plant will produce silicon interposers for the “CoWoS-S” system. An interposer is a special silicon board that connects the processor’s various chip components to high-speed memory blocks called HBM. This component is used to produce complex, multi-chip processors for artificial intelligence and high-performance computing systems. The interposers will not be standardized; they will be designed to match the architecture of each processor. Their design will vary depending on the number, size, and placement of the chip components and HBM blocks. Power consumption and thermal requirements will also be taken into account. “GlobalFoundries” will not sell the products directly to customers but will work as a subcontractor for “TSMC.” The companies must align their manufacturing processes, verify quality, and protect intellectual property.
The agreement covers only the production of interposers. Separate equipment is needed to connect the chip and memory blocks to the board, place them on an organic substrate, and conduct electrical testing. The companies have not disclosed the production volume, the investment to be made in the plant, or how the $2 billion will be allocated. If demand increases, additional production capacity may be created under the agreement. The partnership complements “TSMC”’s plan to begin “CoWoS” and “3D-IC” packaging in Arizona before 2029. “TSMC” has also signed a 10-year agreement with “Amkor Technology,” which is building a plant in Arizona. That facility is expected to begin production in early 2028. This means that the chips could be produced in Arizona and the interposers in New York. Packaging and testing could then be carried out in Arizona. However, the parties have not yet disclosed how the work will be divided or whether the interposers will specifically be used in Arizona.
For this purpose, “GlobalFoundries” will increase the production capacity of its plant in Malta, New York. The plant will produce silicon interposers for the “CoWoS-S” system. An interposer is a special silicon board that connects the processor’s various chip components to high-speed memory blocks called HBM. This component is used to produce complex, multi-chip processors for artificial intelligence and high-performance computing systems. The interposers will not be standardized; they will be designed to match the architecture of each processor. Their design will vary depending on the number, size, and placement of the chip components and HBM blocks. Power consumption and thermal requirements will also be taken into account. “GlobalFoundries” will not sell the products directly to customers but will work as a subcontractor for “TSMC.” The companies must align their manufacturing processes, verify quality, and protect intellectual property. The agreement covers only the production of interposers. Separate equipment is needed to connect the chip and memory blocks to the board, place them on an organic substrate, and conduct electrical testing. The companies have not disclosed the production volume, the investment to be made in the plant, or how the $2 billion will be allocated. If demand increases, additional production capacity may be created under the agreement. The partnership complements “TSMC”’s plan to begin “CoWoS” and “3D-IC” packaging in Arizona before 2029. “TSMC” has also signed a 10-year agreement with “Amkor Technology,” which is building a plant in Arizona. That facility is expected to begin production in early 2028. This means that the chips could be produced in Arizona and the interposers in New York. Packaging and testing could then be carried out in Arizona. However, the parties have not yet disclosed how the work will be divided or whether the interposers will specifically be used in Arizona.